Waterjet Cut, Reamed and Tapped Side Plate for Semiconductor Equipment
Recently contracted by a client to produce side plates intended for use on semi-conductor equipment, we incorporated a variety of production methods to ensure efficient, high-quality results. Using a combination of water jet cutting, tapping, reaming and edge break manufacturing processes, we were able to construct high-quality semi-conductor plates measuring five inches in length, 4.5 inches in width and 3/8 of an inch in thickness. And, using 304 stainless steel base material, we upheld a (+/-) .001 inch tolerance. Through a variety of advanced service capabilities, Austin Waterjet was able to design and build high-quality product that met with our client’s unique specifications.